Board routing is done! Needed to do two iterations on it. The first iteration was routed without using the right dimensions on the outline. Oops. With the proper outline imported, everything needed to be placed closer together. Lesson learned: always import the proper outline (or close to it) as the first step. Alright, so the routing was completed fine. It is a 2 layer board with a copper pour on the back of the board. Tolerances for design for fabrication are 20 mils tracewidth, ample spacing at 10+ mils, and using longpads whenever possible. Vias are large like pads, so they can have a wire pass through them during the assembly stage. Next up is milling the board!
Archives
- March 2021 (2)
- January 2021 (2)
- December 2020 (10)
- November 2020 (7)
- October 2020 (12)
- April 2020 (5)
- March 2020 (11)
- February 2020 (18)
- January 2020 (23)
- December 2019 (18)
Categories
- Announce (1)
- Environment (1)
- News (107)
- Collaboration Logs (14)
- Field Logs (1)
- Progress Logs (53)
- Tech Logs (38)
Tags
aframe
ar
arduino
aws
aws iot
bowie
brain kit
build
cad
chassis
code
collab log
data
documentation
ec2
electronics
esp32
Field Log
imagery
ir camera
javascript
jitsi
kit code
kit log
leds
map
marker
microcontroller
mosquitto
motor kit
mqtt
operator interface kit
outdoors
power pack kit
python
schematic
sensor node
software
ssl
super bright lights kit
team
tech log
testing
uottawa
water